There's no single standard stack-up. At best, PCB manufacturers have a preferred stack-up for general purpose boards that are e.g. made in a production pool. You can browse respective manufacturer web sites, like this http://www.pcb-specification.com/uk
You can presume that a "standard" 6L board is made with two cores. Copper weight, substrate and prepreg thickness vary depending on application requirements.
The board is symmetrical, its around the board centre line that is critical. As the copper weights are all the same for the inner layers you can have it built how you want foil or cores. You can have what you want these days, but anything other than a manufacturers standard method does involve extra cost...
Your stackup is symmetrical and balanced as copper weights are equal on both sides of core. This makes it a standard 6-layer stackup.
But this would not be the best if your are using it for EMI/EMC application. I would recommend this:
There are 4 things that make this stackup work well.
- The close proximity of ground to EVERY trace.
- Signal 3’s secondary reference plane (Layer 4) is much greater than the distance to Layer 2.
- The close proximity of Power and Ground Planes creates planner capacitance.
- Tracing between signal layers 1 and 3 requires no special treatment.
Thanks my friend, I've got the way from a pcbastore, it will be like( SM/Copper/PP/Core/PP/Core/PP/Copper/SM ) which is the cheapest stackup for my design