Re: Bond wire
some typical data for bond wire pad and pin size to a TSOP package.
bond wire (a thin golden wire to connect pad to lead): length 3-5mm, width 0.8mil, parasitics, 1nh/mm, 10mOhm/mm, total cap ~1pf
pad (the connection metal square on silicon): 80u x 80u, total cap ~1.2pf
lead ( the metal routing to connect bondwire touch down point to the pin): width 2mil, length 5~8mm, parasitics 0.8nh/mm, total cap ~2pf
pin( the metals strech out from package): width 1mm, length 5~8mm