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Voltage stress test and Burnin tests

ranger01

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Hi I would like to understand more about the purpose of voltage stress and burnin tests. Based on my understanding burnin is used to catch infant mortalities by applying high toggle patterns at very high temps. Is Voltage stress done separately to stress the device in opposite polarity for longer term ?

Does anybody follow this methodology in post-silicon ?

Is this the correct sequence for mass production testing ?

1. Voltage stress to determine maximum safe value.
2. Burnin stress for days together to catch infant mortalities
3. Run ATPG patterns to catch defects.
 

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