I am trying to simulate two PCB's in ADS momentum. The problem is that each one has a different substrate. it is interesting for me to simulate the pads that I use for joining it too.
Could I simulate both pcbs at the same time with different substrates?
I am trying to simulate two PCB's in ADS momentum. The problem is that each one has a different substrate. it is interesting for me to simulate the pads that I use for joining it too.
You would need the ADS FEM engine to do this, including the gap. Momentum is planar with infinite substrate size, so you can only have one material at any z-position. However, you can try to approximate the effect from pads (using one Momentum model per PCB stackup) and the bond wire inductance.
You would need the ADS FEM engine to do this, including the gap. Momentum is planar with infinite substrate size, so you can only have one material at any z-position. However, you can try to approximate the effect from pads (using one Momentum model per PCB stackup) and the bond wire inductance.
You mean the bond wire part? Attached is a document where I tested bond wire modelling with another planar MoM solver (Sonnet).
This could be applied to Momentum also, but maybe Keysight have a better (easier) way ... From what I remember, they have some special bond wire feature in Momentum -> ask Keysight support.