Three questions about PADS 2007

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tony_taoyh

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Hi, All,

Two questions about PADS2007:

1) How to use fill pattern for the top metal?

Please refer to the attached pic.

Should I do it in "copper pour" or "plane area"?

2) For the layer type, what is the difference between
CAE layer or mixed/split?

3) After the layout is done, I find the "PCB decal" is wrong.
What is the best way to update it?

Thanks a lot.

Tony
 

I find the "PCB decal" is wrong.
What is the best way to update it?

In layout, Set the selection filter "cntrl-alt-f" to parts, click on the part, right click "edit part"
Then File, exit decal editor, yes update part.
 

Hi,

1) You can use 'Copper Pour' to fill in Signal layers. change the Grid/copper width for continuous fill.
2) CAE is referred for Schematic symbols. Split/mixed referred for plane layer in which u can fill copper as well as route also.
3) first update the decal in library. Then in layout using ECO option u can replace the decal.
Click ECO--select the component--RMB Library browse--select the part-- update--then click ALL/selected.

Thanks,
Ahar.
 

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