Three questions about PADS 2007

[tony_taoyh]

Hi, All,

Two questions about PADS2007:

1) How to use fill pattern for the top metal?

Please refer to the attached pic.

Should I do it in "copper pour" or "plane area"?

2) For the layer type, what is the difference between
CAE layer or mixed/split?

3) After the layout is done, I find the "PCB decal" is wrong.
What is the best way to update it?

Thanks a lot.

Tony

 

[Beepster]

I find the "PCB decal" is wrong.
What is the best way to update it?

In layout, Set the selection filter "cntrl-alt-f" to parts, click on the part, right click "edit part"
Then File, exit decal editor, yes update part.

 

[aharsha]

Hi,

1) You can use 'Copper Pour' to fill in Signal layers. change the Grid/copper width for continuous fill.
2) CAE is referred for Schematic symbols. Split/mixed referred for plane layer in which u can fill copper as well as route also.
3) first update the decal in library. Then in layout using ECO option u can replace the decal.
Click ECO--select the component--RMB Library browse--select the part-- update--then click ALL/selected.

Thanks,
Ahar.