Hi,
In pads standard, on my 4 layer board, I am getting thermal reliefs from my vias to the inner ground and power planes. These vias are not connecting to component pads…do you know why PADs standard is putting thermal reliefs here?, and how I can get rid of them?
You can setup the default via to plane connection and behavior for specific plane and net classes. I know how to do the setup e.g. for Mentor Expedition, but I'm not familiar with pads. You should be able to find the settings in the user manual.