I do not know of any books.
But several years ago I looked into potting for a particular high reliability project for a very harsh wet environment, and was advised VERY STRONGLY against potting circuit boards.
The big problem as I understand it, is the exothermic effect during curing is not really controllable, and can reach temperatures high enough to cause serious future reliability issues if not outright failure at final testing.
A much better and more popular technique for electronics is a conformal coating, which military, areospace, and the mining industry, are very fond of.
That is what we ended up doing, and it worked very well for our circuit boards.
Potting seems to work fine for underground cable joints and things like that, but for fragile electronic components it has proved to be very troublesome.
Sorry for veering off topic, but just though I would share my own experiences with potting.
At one time I was involved with high voltage power supplies for pumped laser flash tubes, and the whole thing was immersed in a tank of oil.I worked at a TWTA power supply place and all their 1kw smps's are potted. Due mainly to the high voltage I believed.
Surely. You get the answer by calculating thermal resistances and achieved heat transfer in detail. And compare to natural or forced air cooling solutions.So surely this means this principle of using an intermediary substance such as potting compond or gap pad to get heat conducted away to a metal enclosure is valid?
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