Newbie level 5
I'm looking for a book on thermal design, does anyone offer a book which covers potted assemblies? I've read through the table of contents on every book I can find on electronic thermal design and none of them call out such a popular method as potting the components in a material with a better thermal conductivity than air. Why is this? Every place I have ever worked has potted assemblies of one type or another. Seems like it might be important in a competitive environment like aerospace where every ounce of weight counts reliability is king and the competition is fierce. Maybe it's the fierce competition? Anyhow if anyone knows of a good book which covers this topic please let me know.