Calculate the power dissipated in your circuit, search for the thermal resistance (degrees per watt) and multiply it with the power to get the temperature rise over room temperature.
The thermal resistance is dependent not only of the package type, but also whether or not cooling airflow is present. For an ASIC the vendor must be able to give that figure to you.
Normally, how much is the difference between the juction temperature & ambient temperaure. Because what is specified in the specification is the Juction Temp. & while testing we see(or control) only the ambient temp.
You can use the equation Tj=Tamb+Pd*Rth
where Tj= junction temperature,Tamb=ambient temperature,Pd=dissipated power and Rth=thermal resistance between the junction and air.
Some more analytical information **broken link removed**
Does that means that it depends upon the technolgy also.
It depends only on the power dissapated in the chip. Generally, .8u will be less power hungry and have bigger packages. .13u will be more dense and burn more power so the difference will be more. Again this is all typicl case.