b.o.o.m
Newbie level 4
Hi,
we are currently setting up our qualification process for a new chip and need a test board for highly accelerated stress testing (JESD22-A110-B). Since i don't have any experience with PCB design for this kind of environmental conditions i'm looking for some information about material requirements for such a test board.
The board will be used in a hast chamber and probably driven at a temperature of around 125C with 85% humidity.
What i already got about the PCB requirements is that i need another base material like G200 with chemical gold finish. The traces would be placed on a inner layer for protection of the humidity environment. What are the requirements for the soldering? Is a standard lead soldering process adequate for such applications?
Furthermore i need some capacitors and sockets, but i think there are plenty of products that tolerate such environmental conditions.
Is there anyone who has some experience with such applications?
Thanks in advance.
we are currently setting up our qualification process for a new chip and need a test board for highly accelerated stress testing (JESD22-A110-B). Since i don't have any experience with PCB design for this kind of environmental conditions i'm looking for some information about material requirements for such a test board.
The board will be used in a hast chamber and probably driven at a temperature of around 125C with 85% humidity.
What i already got about the PCB requirements is that i need another base material like G200 with chemical gold finish. The traces would be placed on a inner layer for protection of the humidity environment. What are the requirements for the soldering? Is a standard lead soldering process adequate for such applications?
Furthermore i need some capacitors and sockets, but i think there are plenty of products that tolerate such environmental conditions.
Is there anyone who has some experience with such applications?
Thanks in advance.