Hi,
we are currently setting up our qualification process for a new chip and need a test board for highly accelerated stress testing (JESD22-A110-B). Since i don't have any experience with PCB design for this kind of environmental conditions i'm looking for some information about material requirements for such a test board.
The board will be used in a hast chamber and probably driven at a temperature of around 125C with 85% humidity.
What i already got about the PCB requirements is that i need another base material like G200 with chemical gold finish. The traces would be placed on a inner layer for protection of the humidity environment. What are the requirements for the soldering? Is a standard lead soldering process adequate for such applications?
Furthermore i need some capacitors and sockets, but i think there are plenty of products that tolerate such environmental conditions.
Is there anyone who has some experience with such applications?
Thanks in advance.