No they are not same. SIP (system in package) can hire different chips/dies from different process in one package. This can be quite good for example where you have to get CMOS based parts and HF components in one package (wireless apps). The latter is quite difficult to do in CMOS process. SoC (system on chip) is advantageous in terms of using different components from same process. A good case some logic and memory in one chip in cellular applications.
It is a long discussion, especially for RF applications. One is better for some applications, one is for others. A good discussion is under
**broken link removed**
Some further sources (but these are driven from marketing point of view. I would carefully consider/double check the arguments of suppliers there.
Nearly. SiP or Silicon IP refers to the business model of a fabless company, from which you can buy soft or hard macros of IP building blocks (s. Wiki's explanation). With SoC you rather think of the finished product itself, i.e. the whole System on Chip.
Cheers, erikl
At the end SiP is a SoC and vice verca. Isn't it ?
If I have well understood, a SiP is a circuit constructed with differents dices to perform a complex function and is packaged in the same chip. While a SoC is designed to performs a complex funtion but is implemented on one single dice.
We use SiP for chips integrating different kind of technologies like RF, SOI, etc making the coexistance of these differents technology on the same chip possible.
While SoC are used when the whole circuit can implemented with the same technology.