The term "keepout area" seems somehow self-explanatory, isn't it? Reviewing Figure 38 (SIM900 Hardware Design V2.02) clarifies the reason of the keepouts. It's below the SIM testpoints to assure that they aren't unintentionally shorted. The remaining area below the module will be usually copper-filled.
The term "keepout area" seems somehow self-explanatory, isn't it? Reviewing Figure 38 (SIM900 Hardware Design V2.02) clarifies the reason of the keepouts. It's below the SIM testpoints to assure that they aren't unintentionally shorted. The remaining area below the module will be usually copper-filled.