Johnson
Advanced Member level 2
Let's start a disscussion on placement issue:
Regarding the Hot-Air mounting device requirments, how many space do we need to reserve for every BGA device on Top side? Can we use this space on bottom side for bypass cap placement?
What about PLCC devices?
Is there any component order in placemenet phase - I mean big first, smal first, or BGA first ?
Regarding the Hot-Air mounting device requirments, how many space do we need to reserve for every BGA device on Top side? Can we use this space on bottom side for bypass cap placement?
What about PLCC devices?
Is there any component order in placemenet phase - I mean big first, smal first, or BGA first ?