Q: BGA Footprint Design Rule

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Johnson

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Let's start a disscussion on placement issue:

Regarding the Hot-Air mounting device requirments, how many space do we need to reserve for every BGA device on Top side? Can we use this space on bottom side for bypass cap placement?

What about PLCC devices?

Is there any component order in placemenet phase - I mean big first, smal first, or BGA first ?
 

If the board is dense, the pick-and-place file is sorted so that the lowest components are mounted first since the nozzle may break higher components nearby.

If there are any specific issues with large heavy components, this is dealt with by the manufacturer. You should submit a placement proposal as soon as you have something to show.

This will avoid many problems.
 

How about the BGA moungting cost?

binu g
 

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