What BSIM parameter will change for different process corners (e.g. TT to FF)?
What's the difference between FFF and FF corner? Does the corner with 3rd "F" (poly critical dimension) is different from the FF corner?
Are you sure this is what we call process variation? Because, as far as I know, those are corner simulations and process variation is when you give your stuff to foundry and it comes back and it is not what you have designed
You can actually notice the difference by actually visiting the model files.
Example Difference between FFF ..... FF3F will be that in the former one PMOS is fast NMOS is fast and interconnect modeling is fast and in the next one includes all the cases 3sigma away from normal .....
SO summary is the format can be anything and can wary with different foundary models