Problem with detecting the Vref of testing pad when doing wafer level testing

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fengluan

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For wafer level testing , when the probes are less than 70um deep, all bonding pad are ok, but can't detect the value of Vref from a testing pad, if probes more deeper, Vref can detect ,but a parameter is not correct, and not varied after trimming , maybe the ic has failures, the area of test and trim pad is less than bonding pad.
Thanks for any suggestion
 

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