For Cadstar I use footprints that follow the IPC-7351 format, wich I forgot to mention. All my footprints are done using the IPC calculator and in the past the PCBlibraries Wizard. This covers the basic packages, but some newer more exotic packages are appearing, especially where power is involved, a couple of diode packages have appeared, that are like the TO's but with only two pads, a J lead at one end and a large thermal pad at the other!
I also didn't mention, I have also played about with the shape of solder paste deposit for these types of components, to help balance the forces during reflow to minimise component skew as the solder liquifies.