checkmate
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4 layer pcb stack up
I've read recommended stack-up configurations, mostly using S-G-P-S configurations. There are some which use the more unconventional S-P-G-S stack-up, the reason being components have taken up much of the routing space on the toplayer.
Am I right to say that the ground plane should be closest to the signal plane with a higher routing density?
Another question unrelated to stack-ups. Given the choice, is it better to "snake" a route through IC pads, or switch layers and route through another plane? Is there a general guideline on which option to choose?
I've read recommended stack-up configurations, mostly using S-G-P-S configurations. There are some which use the more unconventional S-P-G-S stack-up, the reason being components have taken up much of the routing space on the toplayer.
Am I right to say that the ground plane should be closest to the signal plane with a higher routing density?
Another question unrelated to stack-ups. Given the choice, is it better to "snake" a route through IC pads, or switch layers and route through another plane? Is there a general guideline on which option to choose?