"Your spacing should firstly be in hard metric as should your design as modern components are hard metric..."
thats good to know; i prefer metric but a lot of datasheets are still in mils, but ill gladly switch to mm.
i reviewed my design.
my BGA has a 0.3mm ball diameter and 0.5 pitch. I used NSMD pads of 0.25mm. I would like to be able to route a trace between 2 rows of pads, but this is not possible at 0.1/0.1mm, but its fine at 0.075mm/0.075mm or barely at 0.1/0.075mm. I am still deciding between those options: 0.075/0.075mm trace between pads, diagonal escape vias for middle row pad (not all pads have a signal), or micro-vias on pads. Please tell me if you think one of these options is better. My BGA has only 3 rows and space in the center.
After having reviewd my design rules, what would be examples of manufacturer that match those specs that you would recommend?
Thank you!