I want to do RF front end PCB layout in ADS.
I want to make QFN package. Can anyone provide me the package for LP5 or LP4 QFN in ADS.
The In-built packages are having leads with bond layer and solder mask.
Is it necessary to specify the bond layer n solder mask on leads. If yes then why?
Do anyone have tutorial / reference of designing PCB layout using agilent ADS? I want to design a QFN package of maxim chip in agilent ADS, but I'm still confused.
Thanks