Aug 11, 2018 #1 P Puppet123 Full Member level 6 Joined Apr 26, 2017 Messages 356 Helped 22 Reputation 44 Reaction score 21 Trophy points 18 Activity points 3,059 I am using a digital process to design MMWAVE and RF circuits. I need to design pads (for G S G probing). This is for over ten GHz. Any resources, papers or thesis on designing pads for these applications?
I am using a digital process to design MMWAVE and RF circuits. I need to design pads (for G S G probing). This is for over ten GHz. Any resources, papers or thesis on designing pads for these applications?
Aug 12, 2018 #2 BigBoss Advanced Member level 6 Joined Nov 17, 2001 Messages 5,955 Helped 1,609 Reputation 3,225 Reaction score 1,593 Trophy points 1,393 Location Türkiye Activity points 35,785 You don't have too much choice..Read the Probe Manufacturer's Guide and place your pads. This a mechanical constraint, you cannot place your pads as you wish..
You don't have too much choice..Read the Probe Manufacturer's Guide and place your pads. This a mechanical constraint, you cannot place your pads as you wish..
Aug 12, 2018 #3 P Puppet123 Full Member level 6 Joined Apr 26, 2017 Messages 356 Helped 22 Reputation 44 Reaction score 21 Trophy points 18 Activity points 3,059 @BigBoss, Thanks for your reply. First I have to make them though in the design kit. I understand I need to place them with proper pitch and so on. But what layers and so on do I use in the PDK and what guidance (papers, etc) is there for such designs. Thank you.
@BigBoss, Thanks for your reply. First I have to make them though in the design kit. I understand I need to place them with proper pitch and so on. But what layers and so on do I use in the PDK and what guidance (papers, etc) is there for such designs. Thank you.
Aug 12, 2018 #4 BigBoss Advanced Member level 6 Joined Nov 17, 2001 Messages 5,955 Helped 1,609 Reputation 3,225 Reaction score 1,593 Trophy points 1,393 Location Türkiye Activity points 35,785 Puppet123 said: @BigBoss, Thanks for your reply. First I have to make them though in the design kit. I understand I need to place them with proper pitch and so on. But what layers and so on do I use in the PDK and what guidance (papers, etc) is there for such designs. Thank you. Click to expand... You have to surely use most upper layer .. Isn't it logical ??
Puppet123 said: @BigBoss, Thanks for your reply. First I have to make them though in the design kit. I understand I need to place them with proper pitch and so on. But what layers and so on do I use in the PDK and what guidance (papers, etc) is there for such designs. Thank you. Click to expand... You have to surely use most upper layer .. Isn't it logical ??
Aug 12, 2018 #5 P Puppet123 Full Member level 6 Joined Apr 26, 2017 Messages 356 Helped 22 Reputation 44 Reaction score 21 Trophy points 18 Activity points 3,059 @BigBoss, thanks for your reply. Yes, I am aware of this. Here is a paper screenshot - 65nm CMOS Pads for MMWave Applications. Look the sectional view on the left and the top view on the right. Question is - the pads on the right and left of the top view - those are just connected to ground or what are they connected to (the ground pads). Attachments Pads.png 16 KB · Views: 67
@BigBoss, thanks for your reply. Yes, I am aware of this. Here is a paper screenshot - 65nm CMOS Pads for MMWave Applications. Look the sectional view on the left and the top view on the right. Question is - the pads on the right and left of the top view - those are just connected to ground or what are they connected to (the ground pads).
Aug 13, 2018 #6 V volker@muehlhaus Advanced Member level 6 Joined Apr 11, 2014 Messages 3,193 Helped 1,071 Reputation 2,146 Reaction score 1,142 Trophy points 1,393 Activity points 20,282 Yes, ground pads are connected to the substrate. You should block dummy metal fill under the signal pad.
Yes, ground pads are connected to the substrate. You should block dummy metal fill under the signal pad.