Package Thermal Resistance of CQFP 44, TQFP 44

Status
Not open for further replies.
T

thevan48

Newbie level 5
Joined
Jul 1, 2010
Messages
10
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Location
Grenoble, France
Activity points
1,343
Hi everybody,
I have to compare the thermal capacity of these packages for my chip: CQFP 44, PLCC 44, QFN 44 and TQFP 44; however i couldn't find the thermal resitance of CQFP 44, TQFP 44 and QFN 44.
Any body can help me?
Thanks alot,
 

A part number would be helpful.
IPC-7093 Design and Assembly Process for Bottom Termination Components is a good guide for QFN based packages.
The data sheet for the relevant part will have thermal resistance figures and probably layout notes on PCB design issues such as number of thermal vias required.
The QFN packages by design tend to be the most thermaly efficient packages, most (not all) have an exposed die attach pad on the bottom to provide a good thermal interface to the PCB.
 
Status
Not open for further replies.

Similar threads

Menu
Log in
Register
Cookies are required to use this site. You must accept them to continue using the site. Learn more…