buenos
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Hi
I got 8 prototypes of my new board design, and 6 of them have intermittent problems.
I suspect that the soldering was not done properly.
This is a double sided SMT board with 7000 components and maybe 60 BGAs.
In the morning when the board is cold those 6 don't start up, they fail with memory initialization. If I heat the memory with an airgun (maybe 150C), then they start up.
I suspect a reflow soldering issue, as I have actually found QFP/SSOP components with unsoldered pins.
What do you think, do the symptoms look like soldering issue?
Can we manually reheat the memory chips with a soldering-airgun (to 280C) to fix this?
How do you adjust the reflow process (th.profile, paste ball size, stencil thickness...)?
I got 8 prototypes of my new board design, and 6 of them have intermittent problems.
I suspect that the soldering was not done properly.
This is a double sided SMT board with 7000 components and maybe 60 BGAs.
In the morning when the board is cold those 6 don't start up, they fail with memory initialization. If I heat the memory with an airgun (maybe 150C), then they start up.
I suspect a reflow soldering issue, as I have actually found QFP/SSOP components with unsoldered pins.
What do you think, do the symptoms look like soldering issue?
Can we manually reheat the memory chips with a soldering-airgun (to 280C) to fix this?
How do you adjust the reflow process (th.profile, paste ball size, stencil thickness...)?