Re: NEED PCB MATERIALS INFO.
The 'FR' stands for flame retardant - nothing more. There are various materials that satisfy the requirement for the FR designation; however, in general, the classes of printed circuit materials are as follows:
FR4 - is a glass fiber epoxy laminate. It is the most commonly used PCB material. The maximum working ambient temperature (defined by the transition temperature from solid to plastic state -Tg) is between 120° and 130°C, depending on thickness.
FR5 - Same as FR4, but the maximum working ambient temperatures are between 140° and 170°C.
FR3 - is basically Fr2, but instead of phenolic resin it uses an epoxy resin binder. The basic layer is paper. It is not suitable for Plated Through Hole.
FR2 - is a paper materials with a phenolic binder. It is UL 94-V0.
FR1 - is basically the same as FR2. FR1 has a higher TG of 130°C instead of 105°C for FR2. Some laminate manufacturers which produce FR1 will not produce FR2, since cost and usage are similar and there is no advantage for having both.
CEM-3 (CEM = Composite Epoxy Material) is very similar to FR4. Instead of woven glass fabric a "flies" type is used. CEM-3 has a milky white color and is very smooth. It is a complete replacement for FR4 and has a very large market share in Japan.
CEM-1 is a paper based laminate with one layer of woven glass fabric. It is not suitable for Plated Through Hole.
G10 is out of fashion now for standard PCB's. it is woven glass fabric with a different epoxy from FR4. It is only UL 94-HB. The main usage nowadays is for thin watch circuit, since it's very punchable.