Miib
Junior Member level 1
Hi guys...i need your advise,
Currently i had working with a 0.5mm pitch BGA, because some of those BGA pads are not used, i plan to remove those pad in over to place a trace under it? will it cause any solder join problems after SMT process? have anyone face this kind of issue before?
Please give my some advise...Thanks
Currently i had working with a 0.5mm pitch BGA, because some of those BGA pads are not used, i plan to remove those pad in over to place a trace under it? will it cause any solder join problems after SMT process? have anyone face this kind of issue before?
Please give my some advise...Thanks