Devil103
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Hi to all
I'm currently working on a standard 4-layer PCB (Signal, Gnd Plane, 1mm FR4 ,VCC, plane, Signal) with microstrip.
Useful frequencies up to around 4 GHz.
Most MWave IC's are based on a QFN package so when using the top signal plane and the GND plane at 0.2 mm distance this gives me a comfortable 50 ohm strip around 10 mils width.
Now, near the end of the chain I would like to place a lumped component filter in 0603 and the pads are quite large compared to the 10 mil microstrip, same goes for the center conductor of the end launch sma connector.
Therefor I would like to switch from ground plane and use the VCC plane as ground reference under those areas which gives me a wider 50 ohm trace more comfortable to solder components on.
Is this feasible and what is the best way to achieve this? Remove parts of the layer 2 gnd plane with a keep out area?
I'm currently working on a standard 4-layer PCB (Signal, Gnd Plane, 1mm FR4 ,VCC, plane, Signal) with microstrip.
Useful frequencies up to around 4 GHz.
Most MWave IC's are based on a QFN package so when using the top signal plane and the GND plane at 0.2 mm distance this gives me a comfortable 50 ohm strip around 10 mils width.
Now, near the end of the chain I would like to place a lumped component filter in 0603 and the pads are quite large compared to the 10 mil microstrip, same goes for the center conductor of the end launch sma connector.
Therefor I would like to switch from ground plane and use the VCC plane as ground reference under those areas which gives me a wider 50 ohm trace more comfortable to solder components on.
Is this feasible and what is the best way to achieve this? Remove parts of the layer 2 gnd plane with a keep out area?