I have worked in technologies that used molybdenum (makes
really nice MIM caps, low bottom-electrode roughness) and
tungsten (no good reason, but they did). MMICs in III-V
technologies still use gold because aluminum is a III dopant
if it is entrained to the substrate.
Tungsten plugs are de rigeur nowadays in CMP processes.
Tiny contacts with high aspect ratios are hard to get good
repeatable reliable fill by simple dep, even hot-metal only
goes so far and you get in-via electromigration or edge-
of-via electromigration. Tungsten fixes this (but puts the
problem onto the contacted layers because you cannot
migrate "make-up" metal along the current track from
layer to via to layer, the tungsten being a hard barrier).