Chap,
It's time to give some brief idea about IO's.
Generally an IO is for Input Ouput inerface reason. These generally calssified as Power Pads and Signal pads. (i.e Power IO's and Signal IO's)
In an Power IO we will be having three sections.
1. Clamp ckt
2. ESD ckt
3. Bond Pad (where we will instantiate a pin in packaging)
.........
what 's the difference between clamp ckt and ESD ckt?
thx!
Added after 1 minutes:
prcken said:
varma_cs012 said:
Chap,
It's time to give some brief idea about IO's.
Generally an IO is for Input Ouput inerface reason. These generally calssified as Power Pads and Signal pads. (i.e Power IO's and Signal IO's)
In an Power IO we will be having three sections.
1. Clamp ckt
2. ESD ckt
3. Bond Pad (where we will instantiate a pin in packaging)
.........
what 's the difference between clamp ckt and ESD ckt?
thx!
what 's the difference between clamp ckt and ESD ckt?
thx!