IO pads all on one side of the chip - possible?

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ebuddy

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I am designing a small chip with SOP8 package. The core area is a rectangle, and there are 6 pads to be placed. Is it possible to place all 6 pads on one side? There is enough room to put them all on one side. By doing this, I can reduce the total chip size. Anyone has done this? Is it allowed at all? Thanks.
 

bonding have some rules to provide reliability and high jield.
Better to follow such recommendations. Some library suppliers have leadframes library,- see AMS DK e.g.
Having it you can in proper scale place your bond pad sketch into needed leadframe (SOP8 e.g.) and to connect pad with leads by 30um wires. That will show clearly existence or absence a bonding problems.
 

since its only 6 pads, theer shld b no problem putting them all on one side.
 

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