VIA as a Testpoint
I use a surface pad, testpoint only, I do not use a component pad. I dont use a via.
It is advised not to stub off with a teest point, this can cause EMC problems. it is best being in line with a track.
these are the "reccomended" things by most knowledgable organisations.
hence I have never had a problem.
yes we use bed of nails type fixtures that put a lot of pressure on the board, although each individual probe is not as lot, they can be sharp.
If you use vias they will need no solder resist on them, which can lead to solder getting in them & outgassing etc.
but circyumstances may depict that you need to use them, after all you only usually test a board once then its sold.
hoever, how do you tell that the test has not caused a premature failure of the via? this does not get tested for.
so I would reccomend that where you can fit a test pad, then do so, where you cannot then use whatever else you can get at &the last thing to use is a via.