how to place bond pads on IOs

hi

I have to place bond pads on the IOs.. I have done the following changes but still I couldnt get bond pads placed...Is there any other changes I have to do

I have changed in LEF

1.I have included at the top of the LEF file.

PROPERTYDEFINITIONS
PIN bondPadOuter STRING ;
PIN bondPadMiddle STRING ;
PIN bondPadInner STRING ;
PIN ioCellOriginX REAL ;
PIN ioCellOriginY REAL ;
MACRO ioCellOffsetX REAL ;
MACRO ioCellOffsetY REAL ;
END PROPERTYDEFINITIONS


2.In IO pad in which I have to place bond pad also I defined as

PIN PAD
PROPERTY bondPadOuter "PBPO_33_33T_CL" ;
PROPERTY bondPadInner "PBPI_33_33T_CL" ;
PROPERTY ioCellOriginX 25.0 ;
PROPERTY ioCellOriginY 0.0 ;
END PAD

and also I have included the bond pads in .v file

I used these commands

staggerBondPad -all -pattern io -pad o PBPO_33_33T_PL i PBPI_33_33T_PL
placeBondPad -ioInstName u_mphy_io_ring/I13 -pad PBPI_33_33T_PL -position I -fix
placeBondPad -ioInstName u_mphy_io_ring/I14 -pad PBPO_33_33T_PL -position O -fix

In my lef
PBP_33_33T_CL It is a core limited bond pad,It doent have inner r outer

In pad limited and core limited pads they defined CLASS as COVER BUMP in LEF file

but I am getting these errors and warnings while loading LEF files
*ERROR: (ENCLF-227): The bump macro 'PBP_33_33T_CL' doesnot have geometry on metal layer so it will be ignored.
**WARN: (ENCVL-346): Module PBP_33_33T_CL is not defined in LEF files. It will be treated as an empty module.
**WARN: (ENCVL-346): Module PBPO_33_33T_PL is not defined in LEF files. It will be treated as an empty module.
**WARN: (ENCVL-346): Module PBPI_33_33T_PL is not defined in LEF files. It will be treated as an empty module.

how to fix these issues???