How to place bond pad

[Greatrebel]

Hi All,

I want to place CUP bond pads on the top of IO pads. After loading Io file, I used the command
placeBondPad -ioInstName IOIN_cs -pad PAD60NU -pinName PAD -position I
But nothing happened, no warning or error, and the bond pad was not placed.

I am wondering how I can place bond pads in Encounter.

Thanks in advanced

 

[pd_people-asrikanth]

yeah, happened same to me

 

[rca]

you need to have the following stuff in your pad lef file:

PROPERTYDEFINITIONS
PIN bondPadOuter STRING ;
PIN bondPadMiddle STRING ;
PIN ioCellOriginX REAL ;
PIN ioCellOriginY REAL ;
MACRO ioCellOffsetX REAL ;
MACRO ioCellOffsetY REAL ;
END PROPERTYDEFINITIONS

and for each pas you want to have the bond pad:
PIN PAD
PROPERTY bondPadOuter "PAD70LU" ;
PROPERTY bondPadMiddle "PAD70LU" ;
PROPERTY ioCellOriginX 0 ;
PROPERTY ioCellOriginY 0 ;
DIRECTION INOUT ;
PORT
....

I try to do with encounter, but the documentation is not very clear, as needed to modify the LEF, and I need the help of Cadence support, he recommended to use the command staggerBondPad.

 

[chuggington]

Rca , Is this valid for the placement of bond pads next to the IO pads too ? In my case, I neednt place the bond pads on top of the io pads.

do you mean that generally for any sort of placement for the bond pads, we need to modify the LEF?

---------- Post added at 09:46 ---------- Previous post was at 09:39 ----------

And these edits should be in the IO PAD lef, is it ?

 

[rca]

Yes you could have the bound pad placed on top of pad contact area.
By default the lef does not contain this code, because, there is less used, and could define outer or middle...
Yes you directly edit the lef file. For a first time, it could we great to used the cadence support.
Because you will need to use froute, the router specific for this routing between the bond and the contact.

 

[chuggington]

Thanks again, rca. I would be getting the netlist today and l'll try out your suggestions. Hope you dont mind if I post back again if I encounter any issue.

 

[chuggington]

I got the netlist with the bond pads in it. I am not yet able to place it correctly. This is what I have done so far :-

1. Edited the IO Pad lef to include


PROPERTYDEFINITIONS
PIN bondPadOuter STRING ;
PIN bondPadMiddle STRING ;
PIN bondPadInner STRING ;
PIN ioCellOriginX REAL ;
PIN ioCellOriginY REAL ;
MACRO ioCellOffsetX REAL ;
MACRO ioCellOffsetY REAL ;
END PROPERTYDEFINITIONS

at the top of the file.

And where the Cell type of the IO pad is defined ,

PIN PAD
PROPERTY bondPadOuter "BGI_BOND_JxM" ;
PROPERTY bondPadMiddle "BGI_BOND_JxM" ;
PROPERTY bondPadInner "BGI_BOND_JxM" ;
PROPERTY ioCellOriginX 25.0 ;
PROPERTY ioCellOriginY 0.0 ;
END PAD

(where BGI_BOND_JXM is the type of Bond pad used ).

After saving the file, when i try to do placeBondPad -ioInstName u_padring/u_pad_gpio6 -pad u_padring/u_bond_gpio6 -position o , it comes out with an error saying that "Io u_padring/u_pad_gpio6 does not have associated bond-pad u_padring/u_bond_gpio6" . Here u_padring/u_pad_gpio6 is the name of the IO pad and u_padring/u_bond_gpio6 is the bond pad.

Am I in the right direction ? Would much appreciate a reply.

-C

 

[chuggington]

One more question - Did you route this using Fcroute ? In my case this is not a flip chip, would i still have to use Fcroute ?

 

[rca]

if you bond pad are just upper the contact pad, you do not need froute.