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If the pin count is low, I can do it with a heat gun. You must mark the PCB with an outline so that you can center the part. Touch a soldering iron to each PCB pad with a little solder and then remove it with solder wick so that each pad is tinned. Place the part on the board and then heat it with the heatgun. I use a wooden toothpick to gently push the part down to hold it in place when the solder reflows. It would be nice to have a paste stencil but sometimes you cannot afford one. This won't work if you have already removed the part and the balls are damaged.
You may get problems even with machine mounted bga chips, especially with fine pitch ones. I have seen a lot! I think XRAY equipment is a must for post manufacturing inspection of bga chips.
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