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I believe our guys use Momentum to get from a
physical 3D model, to a bond shell. This for RF ICs.
There's one CAD guy who really knows how to set it
up and the rest just send him their info. Point being,
it's not just a tool with an "Easy button".
Package alone is only a piece; bond wires are a big
deal, getting mutuals right even needs proper loop
height (and sometimes this is so key, that specific
bonder instructions are developed). Depending on
how high in frequency, and how fussy about RF
attributes, the part may be.