Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

how do we decide on dimensions of masks and layers

Status
Not open for further replies.

ahsoka

Junior Member level 1
Joined
Dec 24, 2007
Messages
16
Helped
1
Reputation
2
Reaction score
1
Trophy points
1,283
Activity points
1,380
Hi,
can anybody tell me how do we decide on dimension of drill,top layer,solder mask,paste mask

EX:
if the drill dia is 'a'
then what is top layer,solder mask,paste mask dimensions

thanks in advance :) :)
 

Pad size (or top layer as you define here) is generally taken to be 0.6-0.8mm bigger than drill with 0.8 being prefered so if we take drill to be "a" tahn pad size will be"a+0.8".
Solder mask is .25 mm more than the pad size so it will be"a+0.8+0.25".
for drilled pads you need not ro provide paste mask.
 

You have to consider annular ring for the hole to pad dimensions.

Solder mask has to be slighly oversized to allow for slight misalignment, historically it has been 0.008" ish, it can be smaller but that makes it harder for the manufacturer & that costs more.

On fine pitch IC's you may have a block of missing solder mask rather than individual pads.

for paste, SMT pads - leave 1:1 and the screen manufacturer will reduce them as required.
pth pads - as they are generally round - identify that they ned removing from the screen.
or if you can reassign a zero size in your CAD package that will ensure they are not used when making the Gerber.
 

Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top