High Speed interconnect CMOS output buffer design

[mohitperceiver]

Can anyone please help me , in providing the necessary interconnect stuff like modeling conductors as transmission line and why they model cmos output buffet by simply thevenin equivalent. What could be the exact way to model the interconnects for high speed design

 

[mdcui]

normally, to quantify the noise introduced by package, you can use simple lumped RLC model, with R around 50~100mohm, L~5~10nh and C~1pf for a typical TSOP package, but if you need accurate analysis, then the signal mutual coupling need to be considered, where you need the 3D model of the package and use software tools like ansoft to extract a netlist of it as interocnnect model.
we don't normally use conductors to build TL, actually hspice/eldo has transmission line model, which works good, just calculate your PCB board/package substrate routing length, translate that into delay number, 1 inch=0.18ns, then add loading on the other side, shall be ok