Re: An interesting layout
In large (long wide) metal traces on an IC, there can be significant movement of the metal with high current densities. To prevent this metal moving about too much and destroying the passivation oxide layers around the metal, stress relief cut outs are employed. This allows an otherwise huge movement of a single metal line to be divided up into smnall components of movement along the track. These stress relief cut outs will be part of the design rule manual for a given technology and is determined by the Fab.
Failure to incorporate stress relief cut outs can lead to early failure of the part in its application. It may not happen immediately, but it will fail.
Most Fabs will either advise what cut outs to use, or will insert them themselves transparent to the designer.