Hi,
while creating footprint you need to follow below things
1.all footprint should be create in top (if it bottom you should not create in bottom you have create in top)
2.Assembly top,Package Height and placement Top must consider (including silkscreen)
3.for smd components better follow IPC standard (IPC 7351)
Hope it will help u
- - - Updated - - -
Hi,
while creating footprint you need to follow below things
1.all footprint should be create in top (if it bottom you should not create in bottom you have create in top)
2.Assembly top,Package Height and placement Top must consider (including silkscreen)
3.for smd components better follow IPC standard (IPC 7351)
Hope it will help u
hi,i am not sure whats kind of footprints you are talking about ,while The total amount of greenhouse gases produced to directly and indirectly support human activities, usually expressed in equivalent tons of carbon dioxide (CO2). this is the meaning of Carbon footprint ,hope to help you !:smile:
The original post mentions pins, silk screen and Orcad and you don't know what type of footprints are being asked about? That doesn't give a lot of confidence in your advertisement for PCB manufacture you have just posted!
A footprint nothing but a land(area) to solder the component.
Footprint will contain pins,silkscreen and assembly(which shows the size of the footprint),pin 1 indication to mount the component properly,
Place bound top(a solid shape in component size to which the height of the component property is added).
There are lot more considerations for creating footprints , Read ipc standard documents you will get a better knowledge.
You would also have solder paste layer, solder resist layer and possibly glue layer. Some of these may be automatically generated depending on the software. You can also define "no-go" areas or "courtyard".