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Bonding pad is used to connect io pad to package pin. and when I used
the method in soc encounter,after doing verification, I find very lot overlap
and short violation between io pad and bonding pad.shoud I check it?
and how to decide the oritentaion of the bonding pad?
thanks a lot!
Added after 2 minutes:
I want to if it appear new drc vioalion after add the bonding pad?