FLIP CHIP Pad and opening

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appledapple

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Hi all! Can anybody help me about flip chip pad and opening at the die side?

We are going to design a SOC in FC, my problem now, are the pads and pad openings are the same size for die side? or the pad opening is smaller than the pad?

Thanks in advance!
 

It is best to work to a particular manufacturers recommendations which depend in how the bumps are going to be added.

Try someone like Unisem **broken link removed**

You may find your fab can make recommendations, although found that to not be the case.

Keith.
 

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