Flex PCB reflow thermal profile

[buenos]

What temperature should I use for reflowing components on a flex polyimide PCB?
Some people say it has to be colder than the usual rigid board temperature, but I cannot find any websites where they state the exact temperature values or where they show a thermal profile for the reflow oven.

 

[D.A.(Tony)Stewart]

Each solder flux and component profile recommendation needs to be considered with assembly methods.

**broken link removed**

 

[buenos]

Thanks.
The presentation shows profiles going up to 230-240C. I think normal reflow for rigid goes up to 260C.

 

[FvM]

Polyimide itself has higher temperature strength than expoxy. It's the lower board thickness and respective lower heat capacity that makes the difference. The critical point is the maximum component temperature during reflow, I expect that package sizes and reflow method heating method matters for the profile.

 

[buenos]

The PCB fab told me that the material they use (PI-FCCL) can be reflowed up to 260-289C. Although I cannot find this info in the datasheet. All it says "300C for 10sec = OK"