Now, the TLP testing method is going to be more and more popular in analyzing the ESD devices. For this new testing method, I have several questiions related to this, does anyone can help me? Thanks.
Do the TLP testing results always correlate with the HBM/MM/CDM zapping test results? I found there is a correlation factor between TLP and HBM/MM/ CDM, does it always a constant or varying with different process/foundry and varying with different ESD circuits (such as diode, ggNMOS, active clamp......)? And, how to find this correlation factor correctly?