I've done quite a few boards in my reflow convection oven (with my own controller). Now I'm doing some more advanced boards with BGA's (0.8mm, 484 pads), and wonder about the reflow temperature profiles; do they refer to air temperature or to the actual PCB temperature?
I've done quite a few boards in my reflow convection oven (with my own controller). Now I'm doing some more advanced boards with BGA's (0.8mm, 484 pads), and wonder about the reflow temperature profiles; do they refer to air temperature or to the actual PCB temperature?
You need to measure the temperature of the PCB as well that's where the correct temperatures are critical, each board will require its own profile... It is the board surface where the solder is, its here that you need to control the temperature!!!