KX36
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Hi all,
I have a question about creepage and clearance ratings and how they compare to the volage ratings of components.
As an example, I'm looking at high voltage chip resistors. https://www.welwyn-tt.com/pdf/datasheet/HVC.pdf
The 2512 package has a limiting element voltage of 3000V, but I can't see how you could get sufficient creepage or clearance between the exposed metal on each side of the component. It does talk of derating this LEV for creepage distance. Would you have to pot around the component with epoxy resin to get sufficient creepage/clearance to use at the specified LEV? Would the potting compond get under the SMD component or would you have to add a slot in the board to help the compound surround it?
This leads to another question. Often you get isolation slots cut in a PCB between pads to increase creepage distance, but the leads of a component rated for a high voltage often come together on the package close together anyway, so surely the closest distance for creepage will be across the insulator of the package and not across the PCB? In which case does it help to cut these slots? I'm thinking of 1000V rated TO-220 MOSFETs in this example.
Cheers,
Matt
I have a question about creepage and clearance ratings and how they compare to the volage ratings of components.
As an example, I'm looking at high voltage chip resistors. https://www.welwyn-tt.com/pdf/datasheet/HVC.pdf
The 2512 package has a limiting element voltage of 3000V, but I can't see how you could get sufficient creepage or clearance between the exposed metal on each side of the component. It does talk of derating this LEV for creepage distance. Would you have to pot around the component with epoxy resin to get sufficient creepage/clearance to use at the specified LEV? Would the potting compond get under the SMD component or would you have to add a slot in the board to help the compound surround it?
This leads to another question. Often you get isolation slots cut in a PCB between pads to increase creepage distance, but the leads of a component rated for a high voltage often come together on the package close together anyway, so surely the closest distance for creepage will be across the insulator of the package and not across the PCB? In which case does it help to cut these slots? I'm thinking of 1000V rated TO-220 MOSFETs in this example.
Cheers,
Matt