As in the title, I need a tutorial/ an explanation on how to choose a thermal profile for an reflow oven, depending on the parts used.
I know there are a few profile recommendations from manufacturers, but what to choose when making boards with many different components?
Is a standard available for this?
One thing for sure, green products (ROHS) need soldering temp up to 270C while gray or non green product require only 240C. The ramp up is still the same, 90 second in temp, 30 sec reflow, 60 sec cooling down.