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check this foot print

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hi raj,

here i mention some exposed pad in that footprint.please check it



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check this link -https://www.edaboard.com/threads/24074/
in your design BGA ball size diameter is 0.45mm ,in BGA 80% ball is placed in assembly side so 0.45*0.8=0.36mm you have create ball size like this
 

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