can anybody give me some description of the following IO

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ys82

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circuit under pad cup io

Can anybody give me some introduce of the following IO type and the difference between these IO type:

1.DUP （device under pad）
2.CUP (circuit under pad)
3.BOAC (Bonding On Active Circuit)

is there any document to introduce these IO type. many thanks !
 

These aren't IO types, but layout methodologies. In former times it wasn't allowed to put active layout structures under the bonding pad. Now it is, under certain circumstances - and with special "pad design rules". The 3 abbreviations mentioned above just say what is allowed (or used).
 

thanks !
so can I think these three(DUP/CUP/BOAC) have the same meaning，
they are referring to active layout structures under the bonding pad ？

What are the advantages of putting active layout structures under the bonding pad ?
 

Main pro: more area available for design.
Main con: channel passivation is not properly performed, so you'll have a device performance degradation depending on transistor size and type.
 

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