jayamohan
Member level 1
BGA Clarification
Hi all,
I am planing to go ahead with Atmel BGA IC for fleet management device.
I need following clarifications on it.
1) The fleet management device will be installed in a dusty environment( in rental cabs). Will the dust get formed in between the BGA IC and PCB and will it cause proble?
2) Will BGA withstand for vibration environment?
3) Reworking on BGA IC will damage the PCB? (In case of IC failure we may need to remove the BGA IC and solder the new one)
4) The BGA rework stations will be too costly?
Can anyone please clarify my doubts?
And also is there any link which can describe about the problems please?
Hi all,
I am planing to go ahead with Atmel BGA IC for fleet management device.
I need following clarifications on it.
1) The fleet management device will be installed in a dusty environment( in rental cabs). Will the dust get formed in between the BGA IC and PCB and will it cause proble?
2) Will BGA withstand for vibration environment?
3) Reworking on BGA IC will damage the PCB? (In case of IC failure we may need to remove the BGA IC and solder the new one)
4) The BGA rework stations will be too costly?
Can anyone please clarify my doubts?
And also is there any link which can describe about the problems please?